ThermalExpansion相关论文
设计了由超低膨胀玻璃材料制作的光学法布里珀罗(F-P)腔及其真空控温系统, 通过双重控温系统实现了F-P腔在环境温度为10~40 ℃范围......
为获得适用于电子封装的W-Cu材料,对60W-40Cu、70W-30Cu、75W-25Cu和80W-5Ni-15Cu合金进行选区激光熔化实验,研究了W含量对合金微......
Effects of Magnesia Fines Addition and Spinel with Different Compositions on Thermal Expansion Behav
Effects of magnesia fines addition (4％,6％ and 8％ in mass ) and spinel with different compositions (alumina-rich,magnesia-ri......
